Silver paste filling hole substrate processing method and process
Time:
2024-10-12
Summary
Silver paste filled hole substrates, also known as pseudo-double-sided boards, are a type of printed circuit board between single-sided and double-sided boards. They consist of circuits on both sides but do not require interlayer connections. They are a special type of double-sided printed circuit board where interlayer connections are not achieved through the copper plating process. This significantly reduces production costs and environmental impact. Interlayer connections are typically achieved through component leads or silver-filled holes. It possesses the functionality of a double-sided board, but its processing method is simpler than that of a double-sided board.
However, the traditional manufacturing process of silver paste filled hole substrates generally involves: material preparation - drilling - dry film lamination - manual visual alignment - development - etching - outer layer AOI - solder resist - legend - tin plating - forming - electrical testing - FQC - FQA - packaging - warehousing. In this traditional process, the photosensitive material used is relatively expensive dry film as the carrier for circuit formation. Since drilling is done before exposure and alignment, the film and holes must be aligned, so only manual visual alignment is used, which is unstable, inefficient, and requires high employee alignment skills. Therefore, this production process has high costs, poor stability, low efficiency, and high demands on employee alignment skills, making it difficult to establish effective core competitiveness in the market.
Aluminum substrate: A circuit board made from aluminum-clad copper-clad laminate using printed circuit manufacturing processes. Aluminum substrates have excellent heat dissipation characteristics. Using aluminum substrate technology instead of epoxy board technology can significantly improve the current density, operating reliability, and service life of various high-power circuits and modules.
Aluminum substrates also have shielding properties, preventing electronic components from being exposed to electromagnetic radiation and interference. Our circuit manufacturing process complies with national and IPC standards.
Silver-filled hole board: A new process board that uses silver paste filling to connect the circuits on both sides, replacing the traditional PTH. Silver-filled hole boards have advantages such as low through-hole resistance (less than 100mΩ) and good conductivity, and have lower production costs, 30-50% lower than PTH processes. The manufacturing process is also more environmentally friendly (no toxic gases or harmful substances are produced during the manufacturing process, unlike PTH electroplating processes), meeting ROHS green product requirements and having good market development potential.
Carbon paste filled hole board: A board that uses carbon paste filling to connect the circuits on both sides, replacing the traditional PTH. Connecting the circuits on both sides with conductive carbon film, for PCBs with low wire resistance requirements, carbon filling can be used to connect through-holes to reduce costs. The through-hole resistance of carbon filling is generally below 50Ω, and the conductivity is stable and reliable. It is commonly used in PCBs for counters and remote controllers.
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