POFV process
Applied industries: Internet of Things
Category:
Products
Silver paste perforated plate
key word:
POFV process
Hotline:
POFV process
Picture and Text Details
|
Product |
PCB Plated Over Filled Via |
|
Application Areas |
Internet of Things |
| Laminate | Ventec/ TG175 |
| Layers | 6L |
| Thickness | 1.0mm |
|
Min. Hole Diameter |
0.25mm |
| Aspect Ratio | 4:1 |
|
Min. Line Width/Space |
0.15/0.127mm |
| Finishing | Electroless Nickel Immersion Gold |
|
Special Requirement |
Whole board resin plug hole, plating filling, resistance |
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